ACM Research, Inc.

ACM Research Inc. is a leading manufacturer of wafer fabrication equipment serving the semiconductor industry worldwide. The company specializes in developing and selling advanced tools for single-wafer and batch wet cleaning, electroplating, stress-free polishing, PECVD, ALD, track, and thermal processes, enhancing productivity, efficiency, and yield in high-volume IC fabrication, compound semiconductors, wafer-level packaging, and wafer manufacturing. Proprietary technologies such as Space Alternated Phase Shift (SAPS™) for uniform cleaning of flat and patterned wafers, Timely Energized Bubble Oscillation (TEBO™) for high-aspect-ratio 3D structures like FinFET and 3D NAND, Ultra SFP for through-silicon vias and fan-out wafer-level packaging, eco-friendly Tahoe SPM cleaning, and Ultra ECP for copper deposition distinguish its offerings. While headquartered in the United States, ACM Research Inc. conducts the majority of its operations through subsidiaries in Shanghai, China, and Inchon, South Korea, supporting customers across Asia, North America, and Europe with customized, sustainable solutions backed by extensive patents. Founded in 1998 in California, it plays a vital role in enabling advanced semiconductor manufacturing processes.