Montage Technology starts trial production of a CXL 3.2 memory controller chip for AI and data centers. Samsung and SK hynix have already integrated it.
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Montage Technology said it has started trial production of what it calls the industry's first CXL 3.2 Memory eXpander Controller chip. The chip is meant to help data centers and AI systems add memory capacity and pool resources more efficiently.
The announcement came from Hengqin, China. The company said the chip integrates a PCIe 6.x PHY, a DDR5 PHY, two RISC-V processor subsystems, and a set of management interfaces. It supports several memory form factors, including PCIe AIC cards and EDSFF modules.
"The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialization," said Stephen Tai, the company's president. "As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data center and AI infrastructure."
Montage also released a software development kit and testing tools to help customers with validation and mass production. The chip has already been integrated into next-generation CXL products by Samsung and SK hynix, with initial validation completed, the company said. The solution is designed to work with Intel Xeon and AMD EPYC server platforms.
Jangseok Choi, vice president of memory product planning at Samsung Electronics, said the combination of the CXL 3.2 MXC with DDR5 memory gives data center customers a balance of performance and capacity. "Our collaboration validates the value of CXL in increasing system memory capacity and resource utilization, and provides additional options for next-generation AI infrastructure," Choi said.
Uksong Kang, head of next gen product planning and standard at SK hynix, pointed to the rapid adoption of large language models and generative AI. "Memory has become a critical factor in system performance," Kang said. "Montage Technology's MXC product demonstrates strong potential for supporting high-capacity memory expansion and resource sharing."
Dr. Debendra Das Sharma, senior fellow and chief I/O architect at Intel, said AI, next-gen cloud systems, and industry economics are reshaping server memory architecture and driving demand for CXL. "Montage Technology's CXL 3.2 MXC demonstrates how the maturing CXL ecosystem delivers protocol support, compatibility, and performance," he said.
Amit Goel, corporate vice president at AMD, said AI and data center workloads are pushing memory to the center of system architecture. "We look forward to our continued collaboration with Montage Technology on CXL technologies to deliver a foundation for building more flexible and efficient memory architectures," Goel said.
Montage Technology plans to show the chip at CXL DevCon and the Future of Memory and Storage exhibition in Santa Clara, California.
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