
The partnership will use RRP's packaging facility to manufacture advanced CMOS sensors for surveillance, targeting India's push for self-reliance in defence semiconductors.
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RRP Electronics and Orvis Semi have teamed up to develop and manufacture low light imaging sensors for defence, surveillance, and security applications. The partnership brings together Orvis Semi's sensor design work, led by IIT Delhi professor Mukul Sarkar, with RRP's semiconductor packaging and assembly capabilities.
Orvis Semi has been building advanced CMOS-based sensors that digitise images and can function as intelligent surveillance devices. Unlike conventional image intensifier tubes, the CMOS approach offers broader functionality and the potential for scaled domestic production, the companies said.
RRP Electronics operates Maharashtra's first operational OSAT – outsourced semiconductor assembly and test – facility. It will handle sensor packaging and assembly, and integrate the sensors into complete electro-optical solutions through its group company, RRP S4E Innovation. The company has already invested in a dedicated mask set at a commercial semiconductor fabrication plant, it said.
The combination of indigenous design, packaging, and system integration creates a complete value chain within India for advanced low light imaging, the companies said. That matters for a country that imports most of its defence electronics and has made self-reliance a policy priority.
Rajendra Chodankar, founder and chairman of RRP Group, said the partnership combines research with manufacturing capabilities to develop technologies that can transform defence and surveillance applications. The company intends to strengthen the nation's strategic capabilities while positioning India as a hub for semiconductor and electro-optical innovation, he added.
The partnership is moving from joint development toward large-scale production. Both companies said they are committed to delivering mission-ready, globally competitive solutions.
For the broader Indian semiconductor sector, the deal shows how OSAT facilities can serve defence needs. Other players in the domestic chip ecosystem – from design houses to packaging firms – may benefit if the government's production-linked incentive scheme accelerates demand for indigenous sensors. The immediate focus, however, is on getting the first batch of sensors into field trials.
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