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Paras Defence arm invests ₹6,200 crore in MP semiconductor packaging plant
Paras Semiconductors, a unit of Paras Defence and Space Technologies, signed an MoU for a ₹6,200 crore OSAT plant in Madhya Pradesh, adding a new domestic competitor in chip packaging.
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Paras Semiconductors, a unit of Paras Defence and Space Technologies, plans to invest ₹6,200 crore in a semiconductor packaging and testing facility in Madhya Pradesh. The company signed a memorandum of understanding with the state government for the project, which will focus on outsourced assembly and test (OSAT) services.
The plant will handle advanced packaging for chips used in automotive, industrial, and telecom applications. Madhya Pradesh has been courting semiconductor investments as part of India's broader push to build domestic chip supply chains.